Extreme ultraviolet light generation apparatus

ABSTRACT

An apparatus for generating extreme ultraviolet light used with a laser apparatus and connected to an external device so as to supply the extreme ultraviolet light thereto includes a chamber provided with at least one inlet through which a laser beam is introduced into the chamber; a target supply unit provided on the chamber configured to supply a target material to a predetermined region inside the chamber; a discharge pump connected to the chamber; at least one optical element provided inside the chamber; an etching gas introduction unit provided on the chamber through which an etching gas passes; and at least one temperature control mechanism for controlling a temperature of the at least one optical element.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a continuation-in-part of U.S. patent application Ser. No. 13/048,454 filed Mar. 15, 2011, which claims priority from Japanese Patent Application No. 2010-063358 filed Mar. 18, 2010, Japanese Patent Application No. 2011-017252 filed Jan. 28, 2011, and Japanese Patent Application No. 2011-049687 filed Mar. 7, 2011. This application further claims priority from Japanese Patent Application No. 2011-135566 filed Jun. 17, 2011.

BACKGROUND

1. Technical Field

This disclosure relates to an extreme ultraviolet (EUV) light generation apparatus.

2. Related Art

In recent years, semiconductor production processes have become capable of producing semiconductor devices with increasingly fine feature sizes, as photolithography has been making rapid progress toward finer fabrication. In the next generation of semiconductor production processes, microfabrication with feature sizes at 60 nm to 45 nm, and further, microfabrication with feature sizes of 32 nm or less will be required. In order to meet the demand for microfabrication with feature sizes of 32 nm or less, for example, an exposure apparatus in which a system for generating EUV light at a wavelength of approximately 13 nm combined with a reduced projection reflective optical system is needed.

Three kinds of systems for generating EUV light are known in general, which include a Laser Produced Plasma (LPP) type system in which plasma is generated by irradiating a target material with a laser beam, a Discharge Produced Plasma (DPP) type system in which plasma is generated by electric discharge, and a Synchrotron Radiation (SR) type system in which orbital radiation is used.

SUMMARY

An apparatus according to one aspect of this disclosure for generating extreme ultraviolet light, which may be used with a laser apparatus and connected to an external device so as to supply the extreme ultraviolet light thereto, may include: a chamber provided with at least one inlet through which a laser beam is introduced into the chamber; a target supply unit provided on the chamber configured to supply a target material to a predetermined region inside the chamber; a discharge pump connected to the chamber; at least one optical element provided inside the chamber; an etching gas introduction unit provided on the chamber through which an etching gas passes; and at least one temperature control mechanism for controlling a temperature of the at least one optical element.

An apparatus according to another aspect of this disclosure for generating extreme ultraviolet light, which may be used with a laser apparatus and connected to an external device so as to supply the extreme ultraviolet light thereto, may include: a chamber provided with at least one inlet through which a laser beam is introduced into the chamber; a target supply unit provided on the chamber configured to supply a target material to a predetermined region inside the chamber; a discharge pump connected to the chamber; a collector mirror for collecting the extreme ultraviolet light emitted from plasma of the target material; and a gas supply unit is provided with a gas outlet and is positioned so that the gas outlet is oriented toward a reflective surface of the collector mirror.

BRIEF DESCRIPTION OF THE DRAWINGS

Hereinafter, selected embodiments of this disclosure will be described with reference to the accompanying drawings.

FIG. 1 schematically illustrates the configuration of an EUV light generation system according to a first embodiment of this disclosure.

FIG. 2 schematically illustrates a reaction in which hydrogen molecules are transformed into hydrogen radicals and the hydrogen radicals react with solid tin (Sn) deposited on an optical element to thereby be turned into stannane gas, and a reaction in which the stannane gas is decomposed and solid Sn is deposited.

FIG. 3 is a graph showing the relationship between the temperature and each of an etching reaction rate of Sn, a deposition reaction rate of Sn, and a total etching rate represented by a difference between the etching reaction rate of Sn and the deposition reaction rate of Sn.

FIG. 4 schematically illustrates the configuration for controlling the temperature of optical elements provided in a chamber according to the first embodiment.

FIG. 5 schematically illustrates the configuration for controlling the temperature of optical elements provided in a chamber of an EUV light generation system according to a second embodiment of this disclosure.

FIG. 6 schematically illustrates the configuration of an EUV light generation system according to a third embodiment of this disclosure.

FIG. 7 schematically illustrates the configuration of a trap positioned to face the reflective surface of an EUV collector mirror in the third embodiment.

FIG. 8 is a perspective view schematically illustrating the configuration of a trap positioned to face a gate valve in the third embodiment.

FIG. 9 schematically illustrates the configuration of a trap provided at a connection part between a chamber and a discharge pump in the third embodiment.

FIG. 10 schematically illustrates the configuration of a trap provided at a predetermined location inside the chamber in the third embodiment.

FIG. 11 schematically illustrates the configuration of a trap and a collection unit in an EUV light generation system according to a fourth embodiment of this disclosure.

FIG. 12A schematically illustrates the configuration of a gas introduction pipe and an EUV collector mirror, as viewed from the reflective surface side of the EUV collector mirror, according to a first modification of this disclosure.

FIG. 12B is a sectional view, taken along XIIB-XIIB plane, schematically illustrating the configuration of the gas introduction pipe and the EUV collector mirror shown in FIG. 12A.

FIG. 13A schematically illustrates the configuration of gas introduction pipes and an EUV collector mirror, as viewed from the reflective surface side of the EUV collector mirror, according to a second modification of this disclosure.

FIG. 13B is a sectional view, taken along XIIIB-XIIIB plane, schematically illustrating the configuration of the gas introduction pipes and the EUV collector mirror shown in FIG. 13A.

FIG. 14A schematically illustrates the configuration of gas introduction pipes and an EUV collector mirror, as viewed from the reflective surface side of the EUV collector mirror, according to a third modification of this disclosure.

FIG. 14B is a sectional view, taken along XIVB-XIVB plane, schematically illustrating the configuration of the gas introduction pipes and the EUV collector mirror shown in FIG. 14A.

FIG. 15A schematically illustrates the configuration of a gas introduction pipe and an EUV collector mirror, as viewed from the reflective surface side of the EUV collector mirror, according to a fourth modification of this disclosure.

FIG. 15B is a sectional view, taken along XVB-XVB plane, schematically illustrating the configuration of the gas introduction pipe and the EUV collector mirror shown in FIG. 15A.

FIG. 16A schematically illustrates the configuration of a gas introduction pipe and an EUV collector mirror, as viewed from the reflective surface side of the EUV collector mirror, according to a fifth modification of this disclosure.

FIG. 16B is a sectional view, taken along XVIB-XVIB plane, schematically illustrating the configuration of the gas introduction pipe and the EUV collector mirror shown in FIG. 16A.

FIG. 17A schematically illustrates the configuration of gas introduction pipes and an EUV collector mirror, as viewed from the reflective surface side of the EUV collector mirror, according to a sixth modification of this disclosure.

FIG. 17B is a sectional view, taken along XVIIB-XVIIB plane, schematically illustrating the configuration of the gas introduction pipes and the EUV collector mirror shown in FIG. 17A.

FIG. 18A schematically illustrates the configuration of gas introduction pipes and an EUV collector mirror, as viewed from the reflective surface side of the EUV collector mirror, according to a seventh modification of this disclosure.

FIG. 18B is a sectional view, taken along XVIIIB-XVIIIB plane, schematically illustrating the configuration of the gas introduction pipes and the EUV collector mirror shown in FIG. 18A.

FIG. 19A schematically illustrates the configuration of a gas introduction pipe and an EUV collector mirror, as viewed from the reflective surface side of the EUV collector mirror, according to an eighth modification of this disclosure.

FIG. 19B is a sectional view, taken along XIXB-XIXB plane, schematically illustrating the configuration of the gas introduction pipe and the EUV collector mirror shown in FIG. 19A.

FIG. 19C is a perspective view schematically illustrating a shape of the leading end portion of the gas introduction pipe according to the eighth modification.

FIG. 20A schematically illustrates the configuration of a gas introduction pipe and an EUV collector mirror, as viewed from the reflective surface side of the EUV collector mirror, according to a ninth modification of this disclosure.

FIG. 20B is a sectional view, taken along XXB-XXB plane, schematically illustrating the configuration of the gas introduction pipe and the EUV collector mirror shown in FIG. 20A.

FIG. 21A schematically illustrates the configuration of radical generators and an EUV collector mirror, as viewed from the reflective surface side of the EUV collector mirror, according to a tenth modification of this disclosure.

FIG. 21B is a sectional view, taken along XXIB-XXIB plane, schematically illustrating the radical generators and the EUV collector mirror shown in FIG. 21A.

FIG. 22A schematically illustrates the configuration of filaments and an EUV collector mirror, as viewed from the reflective surface side of the EUV collector mirror, according to an eleventh modification of this disclosure.

FIG. 22B is a sectional view, taken along XXIIB-XXIIB plane, schematically illustrating the configuration of the filaments and the EUV collector mirror shown in FIG. 22A.

FIG. 23 is a sectional view schematically illustrating the configuration of an EUV light generation system according to a fifth embodiment of this disclosure.

FIG. 24A is a sectional view schematically illustrating the configuration of an EUV light generation system according to a sixth embodiment of this disclosure.

FIG. 24B schematically illustrates the configuration of a filament and an EUV collector mirror, as viewed from the reflective surface side of the EUV collector mirror shown in FIG. 24A.

FIG. 25A schematically illustrates the configuration of an EUV collector mirror and gas introduction pipes, as viewed from the reflective surface side of the EUV collector mirror, according to a seventh embodiment of this disclosure.

FIG. 25B is a sectional view, taken along a plane perpendicular to the reflective surface of the EUV collector mirror, schematically illustrating the configuration a laser beam focusing unit, the EUV collector mirror, and the gas introduction pipes according to the seventh embodiment.

FIG. 26A is a perspective view schematically illustrating the configuration of an inner pipe and a wall unit that are integrated.

FIG. 26B is a sectional view schematically illustrating the configuration of the inner pipe and the wall unit fitted into through-holes.

FIG. 27A is a perspective view schematically illustrating the configuration of an outer pipe, a pipe, and a hydrogen gas supply source.

FIG. 27B is a sectional view illustrating the configuration of the outer pipe shown in FIG. 27A.

DETAILED DESCRIPTION

Hereinafter, selected embodiments for implementing this disclosure will be described in detail with reference to the accompanying drawings. In the subsequent description, each drawing merely illustrates shape, size, and positional relationship schematically to the extent that enables the content of this disclosure to be understood. Thus, this disclosure is not limited to the shape, the size, and the positional relationship illustrated in each drawing. In order to show the configuration clearly, part of the hatching along a section may be omitted in the drawings. Further, numerical values indicated herein are merely examples of this disclosure; thus, this disclosure is not limited to the indicated numerical values.

First Embodiment

An EUV light generation system according to a first embodiment of this disclosure will be described in detail with reference to the drawings. FIG. 1 schematically illustrates the configuration of an EUV light generation system 1 according to the first embodiment.

As shown in FIG. 1, the EUV light generation system 1 may include an airtight chamber 11, an exposure apparatus connection part 13, a droplet generator 14 b provided with a droplet controller 14 a, a pre-pulse laser PL, a main pulse laser ML, and an EUV light generation controller 10. The chamber 11 may define a space where EUV light is generated. The exposure apparatus connection part 13 may optically connect the chamber 11 to an exposure apparatus (not shown). The droplet generator 14 b may be configured to supply a target material, such as tin (Sn), into the chamber 11 in the form of droplets D through a nozzle (not shown). The pre-pulse laser PL may be configured to output a pre-pulse laser beam L1 a. The main pulse laser ML may be configured to output a main pulse laser beam L1 b. The EUV light generation controller 10 may be configured to control the pre-pulse laser PL, the main pulse laser ML, the droplet controller 14 a, and so forth.

The chamber 11 may be provided with windows W1 and W2. The pre-pulse laser beam L1 a and the main pulse laser beam L1 b may pass through the respective windows W1 and W2 and enter the chamber 11, respectively. Off-axis paraboloidal mirrors M2 and M3 for respectively focusing the pre-pulse laser beam L1 a and the main pulse laser beam L1 b in a plasma generation region P1 defined inside the chamber 11 may be provided in the chamber 11. Further, an EUV collector mirror M1 may be provided in the chamber 11, and the EUV collector mirror M1 may be positioned to reflect EUV light L2 generated in the plasma generation region P1 such that the EUV light L2 is focused in an intermediate focus region IF set inside the exposure apparatus connection part 13.

With the above configuration, the EUV light generation controller 10 may control the droplet controller 14 a to thereby control a timing at which the droplet D is outputted from the droplet generator 14 b. The droplet D outputted from the droplet generator 14 b may arrive in the plasma generation region P1. Further, the EUV light generation controller 10 may control a timing at which the pre-pulse laser beam L1 a is outputted from the pre-pulse laser PL and a timing at which the main pulse laser beam L1 b is outputted from the main pulse laser ML. At a timing at which the droplet D arrives in the plasma generation region P1, the pre-pulse laser beam L1 a may be focused on the droplet D by the off-axis paraboloidal mirror M2 (first-stage laser irradiation). With this, the droplet D may be diffused and turned into a state in which weak plasma, neutral particles, clusters, fragments, and the like mixedly exist. In the description to follow, a target material in this state may be referred to as a diffused target.

The main pulse laser beam L1 b from the main pulse laser ML maybe focused on the diffused target in the plasma generation region P1 by the off-axis paraboloidal mirror M3 (second-stage laser irradiation) through a through-hole M1 a formed in the EUV collector mirror M1. With this, the diffused target maybe turned into plasma. The EUV light L2 may be emitted when this plasma is deexcited.

The EUV light L2 emitted from the plasma may be reflected by the spheroidal EUV collector mirror M1 toward the exposure apparatus connection part 13. The reflected EUV light L2 may once be focused in the intermediate focus region IF, and then be outputted to the exposure apparatus through a waveguide, such as a tube (not shown).

In the first embodiment, the target material in the form of a droplet D, may be turned into plasma with two-stage laser beam irradiation. However, this disclosure is not limited thereto, and the target material may be turned into plasma with one-stage, or three-or-more-stage laser beam irradiation. Further, in the first embodiment, the target material may be supplied in the form of droplets. However, this disclosure is not limited thereto, and a solid target material that is rotatably set inside the chamber 11 may also be used.

After the EUV light L2 is emitted, particles of the target material, Sn in this embodiment, such as ions, atoms, charged particles, and neutral particles, hereinafter, collectively referred to as Sn debris, maybe emitted from the plasma generated in the plasma generation region P1. This Sn debris may adhere onto the optical elements, such as the EUV collector mirror M1 and the off-axis paraboloidal mirrors M2 and M3, provided inside the chamber 11, and may be deposited thereon.

Therefore, the EUV light generation system 1 of the first embodiment may include radical generators 15 a through 15 c each configured to supply hydrogen radicals, hereinafter, referred to as H radicals or H*, into the chamber 11, and a discharge pump 12 for discharging a gas from the chamber 11. H radicals from the radical generators 15 a through 15 c may be supplied into the chamber 11 through respective gas introduction pipes 16 a through 16 c extending into the chamber 11. The radical generators 15 a through 15 c and the gas introduction pipes 16 a through 16 c may be positioned to allow an etching gas, such as H radicals or H₂ gas, to flow along the surface of the optical elements provided inside the chamber 11. With this, the etching gas may etch the Sn debris deposited on the optical elements.

Gas discharge ports of the respective gas introduction pipes 16 a through 16 c may point toward the reflective surfaces of the EUV collector mirror M1 and the off-axis paraboloidal mirrors M3 and M2, respectively. With this, the H radicals flowing along the reflective surfaces of the optical elements may react with the Sn debris deposited on the optical elements, and stannane (SnH₄) gas may be produced. This stannane gas is in a gaseous state approximately at or above −52° C. In this way, by allowing Sn and the H radicals to react with each other, the Sn debris deposited on the optical elements may be etched. The stannane gas produced through the etching reaction may be discharged outside the chamber 11 through the discharge pump 12. As a result, performance degradation of the optical elements can be reduced. Note that, in the first embodiment and the other embodiments to be described later, the gas discharge port may be realized by an opening, a slit, or any other suitable form.

In the first embodiment, hydrogen may be supplied in the form of radicals in order to etch the Sn debris deposited on the optical elements with high efficiency. However, this disclosure is not limited thereto, and hydrogen may be supplied in the form of hydrogen molecules (H₂). In this case, the hydrogen molecules may be transformed into the H radicals by ultraviolet light, vacuum ultraviolet light, EUV light, and the like emitted in the plasma generation region P1, and the H radicals produced may react with the Sn debris. As a result, the Sn debris deposited on the optical elements may be etched, and performance degradation of the optical elements may be suppressed. In this example, the radical generators 15 a through 15 c may not be required, and in place of the radical generators 15 a through 15 c, a hydrogen gas supply source may be provided.

Partitions 11 a through 11 c may be provided inside the chamber 11. Each of the partitions 11 a through 11 c may, for example, be plate-shaped. The flow of a gas, such as H radicals, hydrogen gas, and stannane gas, inside the chamber 11 may be controlled with the partitions 11 a through 11 c. As a result, the Sn debris on the optical elements may be etched efficiently, and the stannane gas may be discharged from the chamber 11 efficiently as well. An opening A1 defined between the partitions 11 b and 11 c may serve as a part of a flow channel of the etching gas and as a part of a beam path of the main pulse laser beam L1 b. An opening A2 defined between the partitions 11 a and 11 b may serve as a part of a flow channel of the etching gas and as a part of a beam path of the pre-pulse laser beam L1 a.

Furthermore, the flow of the gas may be controlled with the partitions 11 a through 11 c such that the gas flows from the optical elements toward the plasma generation region P1, whereby the Sn debris may be prevented from adhering onto the optical elements. With this, performance degradation of the optical elements may be suppressed more reliably.

FIG. 2 schematically illustrates a reaction in which hydrogen molecules are transformed into the hydrogen radicals and the hydrogen radicals react with solid Sn deposited on an optical element to thereby be turned into stannane gas, and a reaction in which the stannane gas is decomposed and solid Sn is deposited. The reaction of Sn and the H radicals may be expressed by the following chemical reaction formulae (1) and (2):

etching reaction: Sn(s)+4H*(g)→SnH₄(g)  (1)

deposition reaction: SnH₄→Sn(s)+2H₂  (2)

Here, (s) and (g) indicate a solid state and a gaseous state, respectively. The reactions given by the chemical reaction formulae (1) and (2) may occur simultaneously. A total etching rate Val may be expressed as a difference between an etching reaction rate Ve and a deposition reaction rate Vd, as given by the following expression (3):

Val=Ve−Vd  (3)

The etching reaction rate Ve, the deposition reaction rate Vd, and the total etching rate Val may vary depending on the temperature of a given optical element when the concentrations of H radicals, H₂, and SnH₄ are constant.

FIG. 2 also illustrates the configuration of a temperature control mechanism for controlling the temperature of an optical element. The temperature control mechanism may include a temperature control element 20 b, a power supply 20 a, a temperature sensor 20 c, and a temperature controller 20. The temperature control element 20 b may be provided on an optical element M, such as the EUV collector mirror M1. The power supply 20 a may supply electric current to the temperature control element 20 b. The temperature sensor 20 c may be provided on the optical element M. The temperature controller 20 may be configured to control the electric current to be supplied to the temperature control element 20 b from the power supply 20 a based on the temperature detected by the temperature sensor 20 c. An example of the temperature control element 20 b may include a heater, and the electric current supplied to the heater may be controlled based on the detection result of the temperature sensor 20 c. By use of the temperature sensor 20 c, the temperature may be retained at a predetermined temperature.

The total etching rate Val with respect to a set temperature range, which in this example is from the normal temperature to the temperature at which heating control is possible, has been measured. FIG. 3 is a graph showing the relationship between the temperature and each of the etching reaction rate of Sn, the deposition reaction rate of Sn, and the total etching rate. In FIG. 3, a dashed line indicates the temperature dependency of the etching reaction rate Ve, and a dot-dashed line indicates the temperature dependency of the deposition reaction rate Vd. A solid line indicates the total etching rate Val=Ve−Vd. The total etching rate Val being 0 indicates that the etching reaction rate Ve is equal to the deposition reaction rate Vd. When the etching reaction rate Ve is equal to the deposition reaction rate Vd, Sn on the optical element may not be removed. The total etching rate Val being in a positive range indicates that Sn on the optical element may be etched. Conversely, the total etching rate Val being in a negative range indicates that Sn may further be deposited on the optical element. Therefore, the electric current to be supplied to the temperature control element 20 b from the power supply 20 a may be controlled such that the temperature of the optical element M is retained within a target temperature range. For example, the temperature of the optical element M may be retained in a range of 40° C. to 120° C. inclusive, or in a range of 60° C. to 100° C. inclusive. When the temperature of the optical element M is retained in these ranges, the total etching rate Val may be retained above a target etching rate, and the Sn debris on the optical element maybe removed.

As shown in FIG. 3, the total etching rate Val rises with the increase in the temperature while the temperature of the surface of the optical element is in a range of 0° C. to approximately 60° C. When the temperature of the surface of the optical element exceeds approximately 100° C., the total etching rate Val starts to fall. Accordingly, in the first embodiment, the temperature of the optical element provided in the chamber 11 may be controlled to fall within a temperature range of 40° C. to 120° C. inclusive, or in a temperature range of 60° C. to 100° C. inclusive. As a result, the stannane gas may be prevented from being decomposed, whereby Sn may be prevented from being deposited on the surface of the optical element.

FIG. 4 schematically illustrates the configuration for controlling the temperature of the optical element provided in the chamber according to the first embodiment. In FIG. 4, the windows W1 and W2, the EUV collector mirror M1, and the off-axis paraboloidal mirrors M2 and M3, hereinafter, simply referred to as optical elements W1 and W2 and M1 through M3, are given as examples of the optical elements whose temperature is to be controlled. However, this disclosure is not limited to these.

As shown in FIGS. 1 and 4, the EUV light generation system 1 may include a chiller 17. The chiller 17 may be provided outside the chamber 11. The chiller 17 may feed, into a main supply pipe Cin, a heat carrier, for example, a liquid that is stable at the operating temperature such as temperature-controlled water or oil, to control the temperatures of the optical elements W1 and W2 and M1 through M3. Sub-supply pipes C1in through C5in may branch off from the main supply pipe Cin to the respective optical elements W1 and W2 and M1 through M3. With this arrangement, the temperature-controlled heat carrier fed into the main supply pipe Cin may be supplied to the optical elements W1 and W2 and M1 through M3 via the respective sub-supply pipes C1in through C5in.

The optical elements W1 and W2 and M1 through M3 may include respective heat carrier flow channels C1 through C5. The heat carrier distributed into the sub-supply pipes C1in through C5in from the main supply pipe Cin may flow into the respective heat carrier flow channels C1 through C5 so as to circulate inside the respective optical elements W1 and W2 and M1 through M3. As a result of this arrangement, the temperatures of the optical elements W1 and W2 and M1 through M3 may be controlled to fall within the target temperature range.

The heat carrier having circulated in the heat carrier flow channels C1 through C5 may then flow into sub-discharge pipes Clout through C5out. The sub-discharge pipes Clout through C5out may be connected to a main discharge pipe Cout, which is connected to the chiller 17. With this arrangement, the heat carrier having flowed into the sub-discharge pipes Clout through C5out may return to the chiller 17 via the main discharge pipe Cout. The heat carrier having returned to the chiller 17 may have the temperature thereof readjusted and again be fed into the main supply pipe Cin.

The sub-supply pipes C1in through C5in and the sub-discharge pipes Clout through C5out may respectively be provided with temperature sensors T1in through T5in and T1out through T5out to detect the temperature of the heat carrier flowing through the respective pipes. The total flow rate through the temperature sensors T1in through T5in and T1out through T5out may be controlled, for example, by the EUV light generation controller 10 or by the chiller 17 equipped with a circulation pump (not shown). Using this arrangement, the heat carrier may be supplied smoothly to the optical elements W1 and W2 and M1 through M3.

The sub-discharge pipes Clout through C5out may be provided with respective flow-rate control valves V1 through V5. For example, the EUV light generation controller 10 or the chiller 17 may be configured to control the flow-rate control valves V1 through V5 in order to control the flow rate of the heat carrier flowing in the respective optical elements W1 and W2 and M1 through M3. With this, the flow rate of the heat carrier flowing in the sub-discharge pipes Clout through C5out may be controlled, and in turn, the flow rate of the heat carrier flowing in the optical elements W1 and W2 and M1 through M3 may be controlled. With this, the temperatures of the optical elements W1 and W2 and M1 through M3 may be controlled to fall within the target temperature range.

As described so far, according to the first embodiment, the temperature of the optical element may be controlled so that the target material etched with the etching gas is not deposited on the optical element again. Accordingly, in the EUV light generation system according to the first embodiment, performance degradation of the optical element provided inside the chamber may be suppressed.

Second Embodiment

An EUV light generation system according to a second embodiment of this disclosure will now be described in detail with reference to the drawings.

FIG. 5 schematically illustrates a configuration for controlling the temperatures of the optical elements provided in the chamber of the EUV light generation system according to the second embodiment. In the second embodiment, a temperature control mechanism in which a cooling mechanism and a heating mechanism are combined may be applied to the EUV light generation system 1 of the above-described first embodiment. According to this configuration, a temperature control mechanism which includes the large-capacity chiller 17 maybe used in combination with another temperature control mechanism capable of heating and cooling. In this arrangement, the temperature of the optical elements may be controlled with higher precision. Accordingly, deposition of Sn onto the optical elements may be further reduced.

As shown in FIG. 5, the EUV light generation system of the second embodiment may be similar in configuration to that shown in FIG. 4, but may differ in that the optical elements W1 and W2 and M1 through M3 may further be provided with respective heaters 21 b through 25 b and respective temperature sensors 21 c through 25 c. The heaters 21 b through 25 b may be connected to respective power supplies 21 a through 25 a. The temperature detected by the temperature sensors 21 c through 25 c may be inputted to respective temperature controllers 21 through 25. The temperature controllers 21 through 25 may be configured to control electric current supplied to the heaters 21 b through 25 b from the power supplies 21 a through 25 a so that the temperatures inputted from the temperature sensors 21 c through 25 c fall within the target temperature range. The heaters 21 b through 25 b may be configured to heat the respective optical elements W1 and W2 and M1 through M3 in accordance with the electric current supplied from the power supplies 21 a through 25 a. With this, the temperatures of the optical elements W1 and W2 and M1 through M3 may be controlled to fall within the target temperature range. In a case where the temperature of a given optical element exceeds the target temperature range, the optical element may be cooled with the heat carrier supplied from the chiller 17.

As described above, according to the second embodiment, as in the first embodiment, the temperature of the optical element may be controlled so that the target material etched with the etching gas is not redeposited on the optical element.

Third Embodiment

An EUV light generation system according to a third embodiment of this disclosure will now be described in detail with reference to the drawings. FIG. 6 schematically illustrates a configuration of the EUV light generation system according to the third embodiment. A temperature control mechanism illustrated in FIG. 3 or FIG. 5 may be provided in the EUV light generation system of the third embodiment.

As shown in FIG. 6, an EUV light generation system 3 according to the third embodiment may be similar in configuration to the EUV light generation system 1 shown in FIG. 1, but may differ in that traps 31 through 36 may further be provided in the chamber 11 to trap Sn deposited when the stannane gas is decomposed. The trap 31 may, for example, be positioned to face the reflective surface of the EUV collector mirror M1, and may trap Sn deposited from the stannane gas produced from Sn on the surface of the EUV collector mirror M1. The trap 32 may, for example, be provided in the chamber 11 so as to face a gate valve W3, and may trap Sn deposited from the stannane gas flowing toward the exposure apparatus connection part 13 via the gate valve W3. The trap 33 may, for example, be provided at the connection between the chamber 11 and the discharge pump 12, and may trap Sn deposited from the stannane gas flowing into the discharge pump 12 from the interior of the chamber 11. The traps 34 through 36 may each be provided at a predetermined position inside the chamber 11, such as a position where Sn debris is likely to reach, and may trap Sn deposited from the stannane gas present in the chamber 11.

The temperatures of the traps 31 through 36 may be controlled to be equal to or higher than a temperature at which the stannane gas is decomposed and Sn is deposited, for example, 120° C. As a result, the concentration of the stannane gas inside the chamber 11 may be reduced, and the concentration of the stannane gas near the surface of a Sn layer deposited on the optical element maybe reduced as well. Therefore, the total etching rate may be increased. Further, retaining the temperatures of the traps 31 through 36 below the melting point of Sn, 232° C., may allow Sn deposited from the stannane gas to be fixed on the surfaces of the traps 31 through 36 in a solid state. The traps 31 through 36 may be formed of a material having low reactivity with Sn, such as molybdenum (Mo), titanium (Ti), alumina (Al₂O₃), or the like.

Hereinafter, examples of the traps according to the third embodiment will be described in detail with reference to the drawings.

Trap 31

FIG. 7 is a perspective view schematically illustrating the configuration of a trap positioned to face the reflective surface of the EUV collector mirror in the third embodiment. As shown in FIG. 7, the trap 31 may generally be column-shaped with both ends thereof being open. Specifically, the trap 31 may have a double-ring structure including an outer ring 31A and a laser-beam passing ring 31B. The laser-beam passing ring 31B may be provided at the center of the outer ring 31A. The outer ring 31A and the laser-beam passing ring 31B may be arranged substantially coaxially. The inner space of the laser-beam passing ring 31B may serve as a laser-beam passing hole 31 a 1, through which a laser beam (e.g., the main pulse laser beam L1 b) may pass. A space defined between the outer ring 31A and the laser-beam passing ring 31B may serve as EUV-light passing holes 31 b 1, through which the EUV light L2 may pass. Here, the EUV light L2 reflected by the EUV collector mirror M1 may travel through a space outside the outer ring 31A or inside the laser-beam passing ring 31B aside from the EUV-light passing holes 31 b 1.

Trapping blades 31C may radially extend between the outer surface of the laser-beam passing ring 31B and the inner surface of the outer ring 31A. Each of the trapping blades 31C may be plate-shaped. The trapping blades 31C may be configured to fix the laser-beam passing ring 31B to the outer ring 31A and define the EUV-light passing holes 31 b 1. Sn deposited from the stannane gas passing through the EUV-light passing holes 31 b may be trapped by the trapping blades 31C.

The trap 31 configured as such may be positioned such that the axis of the laser-beam passing ring 31B substantially coincides with the beam axis of a laser beam (e.g., the main pulse laser beam L1 b) focused in the plasma generation region P1 via the through-hole M1 a in the EUV collector mirror M1. Further, the axis of the outer ring 31A may substantially coincide with the axis of the EUV light L2 reflected by the EUV collector mirror M1. With this, the trap 31 may allow the laser beam to pass through the laser-beam passing hole 31 a 1 without blocking the laser beam, and may allow the EUV light L2 reflected by the EUV collector mirror M1 to pass through the EUV-light passing holes 31 b 1 without reducing the energy of the EUV light L2.

The trap 31 may be heated, for example, to a temperature equal to or higher than the temperature at which the stannane gas is decomposed and Sn is deposited, for example, 120° C., as described above. The trap 31 may be provided with a heater 40 b, and a power supply 40 a may be connected to the heater 40 b to supply electric current thereto. The trap 31 may further be provided with a temperature sensor 40 c, and the temperature detected by the temperature sensor 40 c may be inputted to a temperature controller 40. The temperature controller 40 may control the electric current to be supplied to the heater 40 b from the power supply 40 a based on the temperature detected by the temperature sensor 40 c. With this, the trap 31 may be heated to a temperature equal to or higher than the aforementioned temperature, and the stannane gas passing through the trap 31 may be heated, whereby Sn may be deposited on the trap 31. That is, apart of Sn contained in the stannane gas produced from Sn on the surface of the EUV collector mirror M1 may be collected by the trap 31. As a result, the concentration of the stannane gas inside the chamber 11 may be reduced, and the concentration of the stannane gas near the surface of the Sn layer on the optical element may be reduced. Therefore, the total etching rate may be increased. Further, retaining the temperature of the trap 31 below the melting point of Sn may allow Sn to be fixed on the trap 31 in a solid state.

Trap 32

FIG. 8 is a perspective view schematically illustrating the configuration of a trap positioned to face the gate valve in the third embodiment. As shown in FIG. 8, a trap 32 may be generally frustoconical in shape with both ends being open. Specifically, the trap 32 may include an outer ring 32A, a core 32B, and trapping blades 32C. The outer ring 32A may be frustoconical in shape. The core 32B may be rod-shaped and positioned at the center of the outer ring 32A. The trapping blades 32C may radially extend between the core 32B and an inner surface of the outer ring 32A. The core 32B may serve to tie the trapping blades 32C together. The core 32B may be omitted. The inner space of the outer ring 32A may serve as EUV-light passing holes 32 b 1, through which the EUV light L2 may pass. Here, the EUV light L2 reflected by the EUV collector mirror M1 may travel through a space outside the outer ring 32A aside from the EUV-light passing holes 32 b 1.

The trapping blades 32C radially extending between the core 32B and the inner surface of the outer ring 32A may define the EUV-light passing holes 32 b 1. The trapping blades 32C may serve to trap Sn deposited from the stannane gas passing through the EUV-light passing holes 32 b 1.

The trap 32 configured as such may be positioned such that the axis of the outer ring 32A substantially coincides with the axis of the EUV light L2 reflected by the EUV collector mirror M1. With this, the trap 32 may allow the EUV light L2 reflected by the EUV collector mirror M1 to pass therethrough without reducing the energy of the EUV light L2.

The trap 32 may be heated, for example, to a temperature equal to or higher than the temperature at which the stannane gas is decomposed and Sn is deposited, as described above. The configuration and the operation for heating the trap 32 may be similar to those of the trap 31 described above. Thus, detailed description thereof is omitted here. The trap 32 may be heated to a temperature equal to or higher than the aforementioned temperature, and the stannane gas passing through the trap 32 maybe heated and decomposed, whereby Sn may be deposited on the trap 32. That is, Sn contained in the stannane gas flowing into the exposure apparatus connection part 13 via the gate valve W3 may be collected by the trap 32. As a result, the stannane gas may be prevented from flowing into the exposure apparatus. Further, retaining the temperature of the trap 32 below the melting point of Sn may allow Sn to be fixed on the trap 32 in a solid state.

Trap 33

FIG. 9 schematically illustrates the configuration of a trap provided at a connection between the chamber and the discharge pump of the third embodiment. As shown in FIG. 9, a trap 33 may include a plurality of plate-shaped blades 33B arranged substantially parallel to the direction in which the gas flows from the chamber 11 toward the discharge pump 12. The blades 33B may be arranged such that a cross-section thereof has a lattice pattern.

The trap 33 may be heated, for example, to a temperature equal to or higher than the temperature at which the stannane gas is decomposed and Sn is deposited, as described above. The configuration and the operation for heating the trap 33 may be similar to those of the trap 31 described above. Thus, detailed description thereof is omitted here. The trap 33 may be heated to a temperature equal to or higher than the aforementioned temperature, and the stannane gas flowing into the discharge pump 12 may be heated and decomposed when passing through the trap 33, whereby Sn may be deposited on the trap 33. That is, Sn contained in the stannane gas flowing into the discharge pump 12 may be collected by the trap 33. As a result, the stannane gas may be prevented from flowing into the discharge pump 12. Further, retaining the temperature of the trap 33 below the melting point of Sn may allow Sn to be fixed on the trap 33 in a solid state.

Traps 34 through 36

FIG. 10 schematically illustrates the configuration of a trap provided at a predetermined location inside the chamber of the third embodiment. As shown in FIG. 10, each of traps 34 through 36 may include wires or ribbons woven in a three-dimensional net or lattice form.

The stannane gas flowing inside the chamber 11 may pass through any of the traps 34 through 36 or the vicinities thereof. Thus, the traps 34 through 36 may be heated, for example, to a temperature equal to or higher than the temperature at which the stannane gas is decomposed and Sn is deposited, as described above. The configuration and the operation for heating each of the traps 34 through 36 may be similar to those of the trap 31 described above. Thus, detailed description thereof is omitted here. Each of the traps 34 through 36 may be heated to a temperature equal to or higher than the aforementioned temperature, and the stannane gas flowing inside the chamber 11 may be heated and decomposed when passing through any of the traps 34 through 36, whereby Sn may be deposited on any of the traps 34 through 36. With this, Sn contained in the stannane gas inside the chamber 11 may be collected by the traps 34 through 36. Further, retaining the temperature of the traps 34 through 36 below the melting point of Sn may allow Sn to be fixed on the traps 34 through 36 in a solid state. Here, each of the traps 34 through 36 may be formed of a porous material, such as sponge.

Fourth Embodiment

An EUV light generation system according to a fourth embodiment of this disclosure will now be described in detail with reference to the drawings. In the above-described third embodiment, the temperatures of the traps 31 through 36 are controlled to be equal to or higher than the temperature at which the stannane gas is decomposed and Sn is deposited, for example, 120° C., and lower than the melting point of Sn, 232° C., whereby Sn trapped in the traps 31 through 36 is fixed thereon in a solid state. On the other hand, in the fourth embodiment, Sn trapped in the traps 31 through 36 may be liquefied so as to flow out of the traps 31 through 36 by heating the traps 31 through 36 to a temperature equal to or higher than the melting point of Sn. Molten Sn that has flowed out of each of the traps 31 through 36 may be collected in a collection unit, such as a bucket.

FIG. 11 schematically illustrates the configuration of a trap and a collection unit in the EUV light generation system of the fourth embodiment. Note that, in FIG. 11, the trap provided at a connection between the chamber 11 and the discharge pump 12 is shown as an example.

As shown in FIG. 11, in the EUV light generation system of the fourth embodiment, a connection part between the chamber 11 and the discharge pump 12 may be bent in an L-shape. A part of the connection part on the side of the chamber 11 may extend vertically. A part of the connection part on the side of the discharge pump 12 may branch off from the connection part and extend horizontally. The trap 33 may be provided in the part of the connection part extending vertically from the chamber 11. The trap 33 may be provided with the temperature controller 40, the power supply 40 a, the heater 40 b, and the temperature sensor 40 c, and the operation of these components may be similar to that of the third embodiment. With this configuration, the trap 33 may be heated to a temperature equal to or higher than the melting point of Sn, and molten Sn DD may flow out of the trap 33.

A collection unit 40A may be provided at the bottom of the connection part extending vertically from the chamber 11 to collect molten Sn DD flowing out of the trap 33. With this, molten Sn DD flowing out of the trap 33 may be prevented from contaminating the optical elements inside the chamber 11. By forming a connecting portion between the connection part extending from the chamber 11 and the collection unit 40A in a frustoconical shape, molten Sn DD flowing out of the trap 33 may be collected reliably into the collection unit 40A.

In the fourth embodiment, the trap 33 provided at the connection part between the chamber 11 and the discharge pump 12 is shown as an example. However, this disclosure is not limited thereto, and a similar configuration may be applied to any of the traps 31 through 36 of the third embodiment as well. That is, a heater, a power supply, a temperature sensor, a temperature controller, and a collection unit may be provided to each of the traps 31 through 36, whereby Sn trapped in each trap may be collected in a liquid state.

First Modification

Modifications of the gas introduction pipe in the above-described embodiments will now be described in detail with reference to the drawings. In the description to follow, a gas introduction pipe for making H radicals or H₂ gas flow along the reflective surface of the EUV collector mirror M1 will be shown as an example.

A gas introduction pipe according to a first modification will be described in detail with reference to the drawings. FIG. 12A schematically illustrates the configuration of the gas introduction pipe and the EUV collector mirror, as viewed from the reflective surface side of the EUV collector mirror, according to the first modification. FIG. 12B is a sectional view, taken along XIIB-XIIB plane, schematically illustrating the configuration of the gas introduction pipe and the EUV collector mirror shown in FIG. 12A.

As shown in FIGS. 12A and 12B, in the first modification, a gas introduction pipe 16-1 from a radical generator 15 may extend so as to surround the reflective surface of the EUV collector mirror M1. The gas introduction pipe 16-1 may have multiple holes formed therein at substantially equal intervals, as shown by the arrows. The gas introduction pipe 16-1 may be positioned such that the holes are opened toward the reflective surface of the EUV collector mirror M1. The H radicals fed into the gas introduction pipe 16-1 from the radical generator 15 may be blown out through the holes provided in the gas introduction pipe 16-1. With this, the H radicals may flow substantially uniformly along the reflective surface of the EUV collector mirror M1 from the periphery of the reflective surface of the EUV collector mirror M1. As a result, Sn deposited particularly on the reflective surface of the EUV collector mirror M1 maybe etched. Here, the radical generator 15 maybe replaced by a hydrogen gas supply source. In that case, the hydrogen gas may be made to flow along the reflective surface of the EUV collector mirror M1.

The gas introduction pipe 16-1 may, for example, have a gap in a part thereof, so that the droplet D outputted from the droplet generator 14 b is not prevented from traveling toward the plasma generation region P1.

Second Modification

A gas introduction pipe according to a second modification will be described in detail with reference to the drawings. FIG. 13A schematically illustrates the configuration of the gas introduction pipes and the EUV collector mirror, as viewed from the reflective surface side of the EUV collector mirror, according to the second modification. FIG. 13B is a sectional view, taken along XIIIB-XIIIB plane, schematically illustrating the configuration of the gas introduction pipes and the EUV collector mirror shown in FIG. 13A.

As shown in FIGS. 13A and 13B, a plurality of radical generators 15A and 15B may be provided for the EUV collector mirror M1 in the second modification. In the present example, two radical generators 15A and 15B are shown, although other embodiments may use more than two. Alternatively, in place of the radical generators 15A and 15B, hydrogen gas supply sources may be used. The radical generators 15A and 15B may be positioned symmetrically about the center of the reflective surface of the EUV collector mirror M1. A semiarc-shaped gas introduction pipe l6-2 a may extend from the radical generator 15A so as to surround a half of the reflective surface of the EUV collector mirror M1. Similarly, a semiarc-shaped gas introduction pipe 16-2 b may extend from the radical generator 15B so as to surround the other half of the reflective surface of the EUV collector mirror M1. In this way, the reflective surface of the EUV collector mirror M1 may be surrounded by the two semiarc-shaped gas introduction pipes 16-2 a and 16-2 b. Each of the gas introduction pipes 16-2 a and 16-2 b may have multiple holes formed therein at substantially equal intervals, as is shown by the arrows. Each of the gas introduction pipes 16-2 a and 16-2 b may be positioned such that the holes are opened toward the reflective surface of the EUV collector mirror M1. The H radicals fed into the gas introduction pipes 16-2 a and 16-2 b from the respective radical generators 15A and 15B may be blown out through the holes provided in the gas introduction pipes 16-2 a and 16-2 b. With this, the H radicals may flow substantially uniformly along the reflective surface of the EUV collector mirror M1 from the periphery of the reflective surface of the EUV collector mirror M1. As a result, Sn deposited on the reflective surface of the EUV collector mirror M1 may be etched.

The gas introduction pipes 16-2 a and 16-2 b may, for example, be positioned to form gaps therebetween, so that a droplet D outputted from the droplet generator 14 b is not prevented from traveling toward the plasma generation region P1, and so that the droplet D having passed through the plasma generation region P1 is not prevented from traveling toward the droplet collection unit 14 d.

Third Modification

A gas introduction pipe according to a third modification will be described in detail with reference to the drawings. FIG. 14A schematically illustrates the configuration of the gas introduction pipes and the EUV collector mirror, as viewed from the reflective surface side of the EUV collector mirror, according to the third modification. FIG. 14B is a sectional view, taken along XIVB-XIVB plane, schematically illustrating the configuration of the gas introduction pipes and the EUV collector mirror shown in FIG. 14A.

As shown in FIGS. 14A and 14B, in the third modification, a plurality of radical generators 15A through 15D may be provided for the EUV collector mirror M1. In the present example, four radical generators 15A through 15D are shown, although other embodiments may use more than four. Alternatively, in place of the radical generators 15A through 15D, hydrogen gas supply sources maybe used. The radical generators 15A through 15D may be positioned symmetrically at equal intervals about the center of the reflective surface of the EUV collector mirror M1. A quarter-arc-shaped gas introduction pipe 16-3 a may extend from the radical generator 15A so as to surround a quarter of the reflective surface of the EUV collector mirror M1. Similarly, each of quarter-arc-shaped gas introduction pipes 16-3 b through 16-3 d may extend from the respective radical generators 15B through 15D so as to surround a quarter of the reflective surface of the EUV collector mirror M1, each. In this way, the reflective surface of the EUV collector mirror M1 may be surrounded by the four quarter-arc-shaped gas introduction pipes 16-3 a through 16-3 d. Each of the gas introduction pipes 16-3 a through 16-3 d may have multiple holes formed therein at substantially equal intervals, as is shown by the arrows. Each of the gas introduction pipes 16-3 a through 16-3 d may be positioned such that the holes are opened toward the reflective surface of the EUV collector mirror M1. The H radicals fed into the gas introduction pipes 16-3 a through 16-3 d from the respective radical generators 15A through 15D may be blown out through the holes formed in the gas introduction pipes 16-3 a through 16-3 d. With this, the H radicals may flow substantially uniformly along the reflective surface of the EUV collector mirror M1 from the periphery of the reflective surface of the EUV collector mirror M1. As a result, Sn deposited particularly on the reflective surface of the EUV collector mirror M1 may be etched.

The gas introduction pipes 16-3 a and 16-3 d may, for example, be positioned to form gaps therebetween so that the droplet D outputted from the droplet generator 14 b is not prevented from traveling toward the plasma generation region P1, and so that the droplet D having passed through the plasma generation region P1 is not prevented from traveling toward the droplet collection unit 14 d.

A magnetic field B may be generated so as to pass through the plasma generation region P1. Then, Sn debris, such as ions, generated in the plasma generation region P1 may be collected by the magnetic field and into ion collection units 18 a and 18 b. In this case, the gas introduction pipes 16-3 a through 16-3 d may be positioned to form gaps therebetween in order to allow the debris traveling in the magnetic field to pass through the gaps into the ion collection unit 18 a and 18 b.

Fourth Modification

A gas introduction pipe according to a fourth modification will be described in detail with reference to the drawings. FIG. 15A schematically illustrates the configuration of the gas introduction pipe and the EUV collector mirror, as viewed from the reflective surface side of the EUV collector mirror, according to the fourth modification. FIG. 15B is a sectional view, taken along XVB-XVB plane, schematically illustrating the configuration of the gas introduction pipe and the EUV collector mirror shown in FIG. 15A.

As shown in FIGS. 15A and 15B, a gas introduction pipe 16-4 of the fourth modification may be curved in an arch and be positioned such that the arch follows the reflective surface of the EUV collector mirror M1 and such that the gas introduction pipe 16-4 extends linearly across the reflective surface of the EUV collector mirror M1 as viewed from the reflective surface side of the EUV collector mirror M1. A curved portion 16-4 a in a semiarc shape may be formed at substantially the middle of the gas introduction pipe 16-4. The gas introduction pipe 16-4 may be positioned so that the curved portion 16-4 a does not overlap the through-hole M1 a in the EUV collector mirror M1.

The gas introduction pipe 16-4 having such a shape may be provided within an obscuration region E of EUV light L2. The obscuration region may refer to a region corresponding to a predetermined angular range, and a part of EUV light collected by the EUV collector mirror corresponding to the obscuration region may not be used for exposure. That is, the obscuration region is a three-dimensional region included in the angular range of the EUV light which is not used for exposure.

The gas introduction pipe 16-4 may have multiple holes formed therein on two opposite sides at substantially equal intervals, as is shown by the arrows. The gas introduction pipe 16-4 may be positioned so that the holes are opened to allow the H radicals to flow along the reflective surface of the EUV collector mirror M1. The H radicals fed into the gas introduction pipe 16-4 from the radical generator 15 may be blown out through the holes formed in the gas introduction pipe 16-4. With this, the H radicals may flow substantially uniformly along the surface of the reflective surface of the EUV collector mirror M1 from the center line passing through the through-hole M1 a across the reflective surface of the EUV collector mirror M1. As a result, Sn deposited particularly on the reflective surface of the EUV collector mirror M1 maybe etched. Here, the radical generator 15 may be replaced by a hydrogen gas supply source. In that case, the hydrogen gas may be made to flow along the reflective surface of the EUV collector mirror M1.

Since the gas introduction pipe 16-4 is curved along the reflective surface of the EUV collector mirror M1, the droplet D outputted from the droplet generator 14 b may not be prevented from traveling toward the plasma generation region P1.

Fifth Modification

A gas introduction pipe according to a fifth modification will be described in detail with reference to the drawings. FIG. 16A schematically illustrates a configuration of the gas introduction pipe and the EUV collector mirror, as viewed from the reflective surface side of the EUV collector mirror, according to the fifth modification. FIG. 16B is a sectional view, taken along XVIB-XVIB plane, schematically illustrating the configuration of the gas introduction pipe and the EUV collector mirror shown in FIG. 16A.

As shown in FIGS. 16A and 16B, a gas introduction pipe 16-5 of the fifth modification may be curved in an arch and be positioned such that the arch follows the reflective surface of the EUV collector mirror M1 from one edge toward the through-hole M1 a and such that the gas introduction pipe 16-4 extends linearly across the reflective surface of the EUV collector mirror M1 as viewed from the reflective surface side of the EUV collector mirror M1. A circular portion 16-5 a may be formed at a leading end of the gas introduction pipe 16-5, and the gas introduction pipe 16-5 may be positioned such that the circular portion 16-5 surround the through-hole M1 a so as not to overlap the through-hole M1 a. The gas introduction pipe 16-5 of the fifth modification may be provided in the obscuration region E of the EUV light L2.

The circular portion 16-5 a may have multiple holes formed therein at substantially equal intervals, as shown by the arrows. The gas introduction pipe 16-5 may be positioned such that the holes are opened toward the periphery so as to make the H radicals flow along the reflective surface of the EUV collector mirror M1. The H radicals fed into the gas introduction pipe 16-5 from the radical generator 15 maybe blown out through the holes formed in the circular portion 16-5 a. As a result, the H radicals may flow substantially uniformly along the reflective surface of the EUV collector mirror M1 from the vicinity of the through-hole M1 a, and Sn deposited particularly on the reflective surface of the EUV collector mirror M1 may be etched. Here, the radical generator 15 may be replaced by a hydrogen gas supply source, in which case the hydrogen gas may flow along the reflective surface of the EUV collector mirror M1.

Since the gas introduction pipe 16-5 may be curved along the reflective surface of the EUV collector mirror M1, the droplet D outputted from the droplet generator 14 b may not be prevented from traveling toward the plasma generation region P1.

Sixth Modification

A gas introduction pipe according to a sixth modification will be described in detail with reference to the drawings. FIG. 17A schematically illustrates the configuration of the gas introduction pipes and the EUV collector mirror, as viewed from the reflective surface side of the EUV collector mirror, according to the sixth modification. FIG. 17B is a sectional view, taken along XVIIB-XVIIB plane, schematically illustrating the configuration of the gas introduction pipes and the EUV collector mirror shown in FIG. 17A.

As shown in FIGS. 17A and 17B, gas introduction pipes 16-6 a through 16-6 d of the sixth modification may each be curved at a portion thereof and be positioned so as to project from a rear surface side of an EUV collector mirror M1 toward the reflective surface side through the through-hole M1 a. The gas introduction pipes 16-6 a through 16-6 d may be arranged symmetrically about the center of the reflective surface of the EUV collector mirror M1.

Each of leading end portions of the respective gas introduction pipes 16-6 a through 16-6 d projecting through the through-hole M1 a may have multiple holes formed therein, as shown by the arrows. The gas introduction pipes 16-6 a through 16-6 d may be positioned so that the holes are opened toward the reflective surface of the EUV collector mirror M1. The H radicals fed into the gas introduction pipes 16-6 a through 16-6 d from the radical generator 15, such as shown in FIG. 16A, may be blown out through the holes in the respective leading end portions. With this, the H radicals may flow substantially uniformly along the reflective surface of the EUV collector mirror M1 from the vicinity of the through-hole M1 a. As a result, Sn deposited particularly on the reflective surface of the EUV collector mirror M1 maybe etched. Here, the radical generator 15 may be replaced by a hydrogen gas supply source, in which case the hydrogen gas may flow along the reflective surface of the EUV collector mirror M1.

Seventh Modification

A gas introduction pipe according to a seventh modification will be described in detail with reference to the drawings. FIG. 18A schematically illustrates the configuration of the gas introduction pipes and the EUV collector mirror, as viewed from the reflective surface side of the EUV collector mirror, according to the seventh modification. FIG. 18B is a sectional view, taken along XVIIIB-XVIIIB plane, schematically illustrating the configuration of the gas introduction pipes and the EUV collector mirror shown in FIG. 18A.

As shown in FIGS. 18A and 18B, gas introduction pipes 16-7 a through 16-7 d of the seventh modification may each be curved at a portion thereof and be positioned so as to project from the rear surface side of an EUV collector mirror M1 toward the reflective surface side through the through-hole M1 a. Portions of the respective gas introduction pipes 16-7 a through 16-7 d projecting through the through-hole M1 a may each extend toward the edge of the reflective surface of the EUV collector mirror M1 and be curved to follow along the reflective surface of the EUV collector mirror M1. The gas introduction pipes 16-7 a through 16-7 d may be arranged symmetrically about the center of the reflective surface of the EUV collector mirror M1.

The portions of the gas introduction pipes 16-7 a through 16-7 d projecting through the through-hole M1 a may have multiple holes formed therein, as shown by the arrows. The gas introduction pipes 16-7 a through 16-7 d may be positioned so that the holes are opened toward the reflective surface of the EUV collector mirror M1. The H radicals fed into the gas introduction pipes 16-7 a through 16-7 d from the radical generator 15, such as shown in FIG. 16A, maybe blown out through the holes formed therein. With this, the H radicals may flow substantially uniformly along the reflective surface of the EUV collector mirror M1. As a result, Sn deposited particularly on the reflective surface of the EUV collector mirror M1 maybe etched. Here, the radical generator 15 may be replaced by a hydrogen gas supply source, in which case the hydrogen gas may flow along the reflective surface of the EUV collector mirror.

Eighth Modification

A gas introduction pipe according to an eighth modification will be described in detail with reference to the drawings. FIG. 19A schematically illustrates the configuration of the gas introduction pipe and the EUV collector mirror, as viewed from the reflective surface side of the EUV collector mirror, according to the eighth modification. FIG. 19B is a sectional view, taken along XIXB-XIXB plane, schematically illustrating the configuration of the gas introduction pipe and the EUV collector mirror shown in FIG. 19A. FIG. 19C is a perspective view schematically illustrating the shape of the leading end portion of the gas introduction pipe according to the eighth modification.

As shown in FIGS. 19A through 19C, a gas introduction pipe 16-8 of the eighth modification may include a generally conical outer plate 16-8 a and a generally conical inner plate 16-8 b. The outer plate 16-8 a may be shaped such that the leading end thereof is folded back in a dome-shape. Similarly, the inner plate 16-8 b may be shaped such that the leading end thereof is folded back in a dome-shape. The dome-shaped end of the inner plate 16-8 b may project from the opening in the outer plate 16-8 a so as to cover the dome-shaped end of the outer plate 16-8 a with a gap therebetween. The gas introduction pipe 16-8 may be positioned such that the leading end of the gas introduction pipe 16-8 projects from the rear surface side of the EUV collector mirror M1 toward the reflective surface side through the through-hole M1 a. A gap 16-81 may be defined between the outer plate 16-8 a and the inner plate 16-8 b, and may open up at one end toward the reflective surface of the EUV collector mirror M1. The H radicals may flow into the gap 16-81 from the rear surface side of the EUV collector mirror M1, and then be blown out through the opening at the end facing toward the reflective surface of the EUV collector mirror M1. With this, the H radicals may flow substantially uniformly along the reflective surface of the EUV collector mirror M1 from the vicinity of the through-hole M1 a. As a result, Sn deposited particularly on the reflective surface of the EUV collector mirror M1 may be etched.

Ninth Modification

A gas introduction pipe according to a ninth modification will be described in detail with reference to the drawings. In the above-described embodiments and modifications, H₂ is turned into H radicals, and the H radicals are made to flow along the surfaces of the optical elements. In contrast, in the ninth modification, instead of the H radicals, H₂ gas may be blown against the optical elements in the chamber 11 (see FIG. 1 or 6), in particular against the EUV collector mirror M1 that is irradiated with EUV light L2 more intensely. FIG. 20A schematically illustrates the configuration of the gas introduction pipe and the EUV collector mirror, as viewed from the reflective surface side of the EUV collector mirror, according to the ninth modification. FIG. 20B is a sectional view, taken along XXB-XXB plane, schematically illustrating the configuration of the gas introduction pipe and the EUV collector mirror shown in FIG. 20A.

As shown in FIGS. 20A and 20B, a gas introduction pipe 16-9 of the ninth modification may be in any shape that does not substantially block the EUV light L2 reflected by the EUV collector mirror M1. The gas introduction pipe 16-9 may be positioned such that the H₂ gas flows along the reflective surface of the EUV collector mirror M1.

The H₂ gas flowing along the reflective surface of the EUV collector mirror M1 may be irradiated with short-wavelength light, such as ultraviolet light, vacuum ultraviolet light, and EUV light L2 generated in the plasma generation region P1, whereby the H₂ gas may be turned into H radicals. As a result, hydrogen may flow in the form of H radicals along the reflective surface of the EUV collector mirror M1, and Sn deposited particularly on the reflective surface of the EUV collector mirror M1 may be etched.

Tenth Modification

A radical generator according to a tenth modification will be described in detail with reference to the drawings. In the above-described embodiments and modifications, the H radicals or the H₂ gas are/is made to flow along the surfaces of the optical elements via a gas introduction pipe. However, this disclosure is not limited thereto. A radical generator may be provided to directly apply the H radicals or the H₂ gas on the surfaces of the optical elements. FIG. 21A schematically illustrates the configuration of the radical generator and the EUV collector mirror, as viewed from the reflective surface side of the EUV collector mirror, according to the tenth modification. FIG. 21B is a sectional view, taken along XXIB-XXIB plane, schematically illustrating the radical generator and the EUV collector mirror shown in FIG. 21A.

As shown in FIGS. 21A and 21B, in the tenth modification, radical generators 15-10 a and 15-10 b may be provided for the EUV collector mirror M1. Alternatively, in place of the radical generators 15-10 a and 15-10 b, hydrogen gas supply sources may be used. The radical generators 15-10 a and 15-10 b may be arranged symmetrically about the center of the EUV collector mirror M1 above the reflective surface of the EUV collector mirror M1. Radical output ports of the respective radical generators 15-10 a and 15-10 b may be oriented such that the H radicals flow along the reflective surface of the EUV collector mirror M1. With this, the H radicals from the radical generators 15-10 a and 15-10 b may flow substantially uniformly along the reflective surface of the EUV collector mirror M1 from the periphery of the reflective surface of the EUV collector mirror M1. As a result, Sn deposited on the reflective surface of the EUV collector mirror M1 may be etched.

Eleventh Modification

An eleventh modification will be described in detail with reference to the drawings. In the above-described embodiments and modifications, H radicals or H₂ gas are/is made to flow along the surfaces of the optical elements via a gas introduction pipe. However, this disclosure is not limited thereto. Filaments may be provided in the vicinity of the optical element to turn the H₂ gas into the H radicals. In this configuration, the chamber 11 may be filled with the H₂ gas. FIG. 22A schematically illustrates the configuration of the filaments and the EUV collector mirror, as viewed from the reflective surface side of the EUV collector mirror, according to the eleventh modification. FIG. 22B is a sectional view, taken along XXIIB-XXIIB plane, schematically illustrating the configuration of the filaments and the EUV collector mirror shown in FIG. 22A.

As shown in FIGS. 22A and 22B, in the eleventh modification, a plurality of filaments 16-11 may be provided for the EUV collector mirror M1. The filaments 16-11 may be arranged symmetrically about the center of the EUV collector mirror M1 outside the reflective surface of the EUV collector mirror M1. The H₂ gas may be turned into the H radicals as the H₂ gas receives energy when passing near the filaments 16-11. Then, the H radicals may be incident on the reflective surface of the EUV collector mirror M1. As a result, Sn deposited particularly on the reflective surface of the EUV collector mirror M1 may be etched.

Fifth Embodiment

An EUV light generation system according to a fifth embodiment of this disclosure will now be described in detail with reference to the drawing. In the above-described embodiments and modifications, Sn deposited on the optical element may be etched by making the H radicals or the H₂ gas flow along the reflective surface while the EUV light generation system is in operation. In contrast, in the fifth embodiment, Sn deposited on the optical element may be etched by making the H radicals or the H₂ gas flow over the entire reflective surface of the optical element while the EUV light generation system is not in operation. FIG. 23 is a sectional view schematically illustrating the configuration of the EUV light generation system according to the fifth embodiment.

As shown in FIG. 23, a chamber 11A of the fifth embodiment may have a gate W4 a formed in the wall, and a radical generator 16-12 may be introduced into or retracted from a predetermined position facing the reflective surface of the EUV collector mirror M1 through the gate W4 a. The gate W4 a may be sealed airtightly with a shutter W4. With this configuration, while the EUV light generation system is not in operation, the shutter W4 may be moved to open the gate W4 a, and the radical generator 16-12 maybe introduced into the chamber 11A. Then, the H radicals or the H₂ gas maybe blown against the entire reflective surface of the EUV collector mirror M1 from the radical generator 16-12. As a result, Sn deposited on the EUV collector mirror M1 may be etched.

Sixth Embodiment

An EUV light generation system according to a sixth embodiment of this disclosure will now be described in detail with reference to the drawings. In the sixth embodiment, the radical generator 16-12 of the above-described fifth embodiment may be replaced by a gas introduction pipe and a filament. The H₂ gas may be blown out through the gas introduction pipe, and then the H₂ gas may be turned into the H radicals through the filament. FIG. 24A is a sectional view schematically illustrating the configuration of the EUV light generation system according to the sixth embodiment. FIG. 24B schematically illustrates the configuration of the filament and the EUV collector mirror shown in FIG. 24A, as viewed from the reflective surface side of the EUV collector mirror.

As shown in FIGS. 24A and 24B, in the sixth embodiment, a gas introduction pipe 16-13 a may be introduced into a chamber 11A. The gas introduction pipe 16-13 a may be connected to an H₂ gas cylinder (not shown). A filament 16-13 may be provided at a gas output port of the gas introduction pipe 16-13 a to turn H₂ gas into H radicals. While the EUV light generation system is not in operation, the shutter W4 may be moved to open a gate W5, and the gas introduction pipe 16-13 a may be introduced into the chamber 11A. Then, electric current may be supplied to the filament 16-13 and the H₂ gas may be made to flow into the gas introduction pipe 16-13 a. With this, the H₂ gas from the gas introduction pipe 16-13 a may be turned into the H radicals, which then may be blown against the entire reflective surface of the EUV collector mirror M1. As a result, Sn deposited on the EUV collector mirror M1 may be etched.

Seventh Embodiment

An EUV light generation system according to a seventh embodiment of this disclosure will now be described in detail with reference to the drawings. FIG. 25A schematically illustrates the configuration of an EUV collector mirror and gas introduction pipes, as viewed from the reflective surface side of the EUV collector mirror, according to the seventh embodiment. FIG. 25B is a sectional view schematically illustrating the configuration of a laser beam focusing unit, the EUV collector mirror, and the gas introduction pipes according to the seventh embodiment, taken along a plane perpendicular to the reflective surface of the EUV collector mirror.

As shown in FIGS. 25A and 25B, the gas introduction pipes of the seventh embodiment may include an outer pipe 263, an inner pipe 264, and a wall unit 265. The EUV collector mirror M1 may be fixed onto the plate H1. The plate H1 may be fixed inside the chamber 11.

The laser beam focusing optical unit 210 may include a window W2, an off-axis paraboloidal convex mirror 212, and a spheroidal concave mirror 213 arranged in this order in the direction in which the pre-pulse laser beam L1 a and/or the main pulse laser beam L1 b, here shown generically as L1, travel (s).

The off-axis paraboloidal convex mirror 212 and the spheroidal concave mirror 213 may be provided inside a sub-chamber 211. The sub-chamber 211 may be in communication with a hydrogen gas supply source 251 through a pipe 261. The hydrogen gas supply source 251 may be replaced by a radical generator. The pipe 261 may be positioned so that the H₂ gas from the pipe 261 flows along the surface of the window W2. The sub-chamber 211 may be fixed onto the plate H1. Alternatively, the sub-chamber 211 may be provided inside the chamber 11, or may be fixed to the outer wall of the chamber 11.

The sub-chamber 211, the plate H1, and the EUV collector mirror M1 may, respectively, have through-holes 211 a, H1 a, and M1 a formed therein, through which the laser beam L1 travels toward the plasma generation region P1. The sub-chamber 211 may generally be sealed airtightly except at the connection part between the sub-chamber 211 and the pipe 261 and at the through-hole 211 a. The inner pipe 264 and the wall unit 265 may be fitted into the through-hole 211 a.

FIG. 26A is a perspective view schematically illustrating the configuration of the inner pipe 264 and the wall unit 265 that are integrated. FIG. 26B is a sectional view schematically illustrating the configuration of the inner pipe 264 and the wall unit 265 fitted into the through-holes 211 a, H1 a, and M1 a.

As shown in FIGS. 26A and 26B, the wall unit 265 may be a frustconical hollow member having openings 265 a and 265 b formed at the ends. The hollow part of the wall unit 265 may serve as a path through which the pre-pulse laser beam L1 a and/or the main pulse laser beam L1 b travel(s). The wall unit 265 may be positioned such that the axis passing through the centers of the respective openings 265 a and 265 b coincide with the beam axis of the pre-pulse laser beam L1 a and/or the main pulse laser beam L1 b reflected by the spheroidal concave mirror 213. The solid angle formed by the inner surface of the wall unit 265 may be substantially equal to the focusing solid angle of the pre-pulse laser beam L1 a and/or the main pulse laser beam L1 b reflected by the spheroidal concave mirror 213. With this configuration, even when a part of the pre-pulse laser beam L1 a and/or the main pulse laser beam L1 b strikes the inner surface of the wall unit 265, the angle of incidence of the laser beam may be relatively large; thus, the damage to the wall unit 265 may be kept small.

The inner pipe 264 may include first and second members. Each of the first and second members may include a frustconical hollow body part and a trumpet-shaped folded part. The inner diameter of the body part of the first member may be larger than the outer diameter of the body part of the second member. The first and second members may be fixed to each other with a spacer or the like (not shown) provided therebetween so as to form a substantially uniform gap. The assembled first and second members may form an opening 264 a, through which the H₂ gas flows into the inner pipe 264, and an opening 264 b, through which the H₂ gas flows out of the inner pipe 264.

The body part of the second member may be fixed onto the wall unit 265 at a bottom portion of the wall unit 265. The opening 264 a in the inner pipe 264 may be positioned on the same plane as the opening 265 a in the wall unit 265. The body part of the first member may be fixed to the periphery of the through-hole 211 a in the sub-chamber 211. The inner pipe 264 may be positioned so that the H₂ gas that flows out through the opening 264 b flows radially along the reflective surface of the EUV collector mirror M1 from the center to the periphery thereof.

FIG. 27A is a perspective view schematically illustrating the configuration of the outer pipe 263, a pipe 262, and a hydrogen gas supply source 252. FIG. 27B is a sectional view illustrating the configuration of the outer pipe 263 shown in FIG. 27A.

As shown in FIGS. 27A and 27B, the outer pipe 263 may be annular in shape. The outer pipe 263 may be connected to the hydrogen gas supply source 252 through the pipe 262. The hydrogen gas supply source 252 may be replaced by a radical generator. A slit 263 a may be formed in the inner side of the outer pipe 263 to serve as an outlet for the H₂ gas. The slit 263 a may be formed so as to surround the inner side of the outer pipe 263. The slit 263 a may, for example, be formed to face the reflective surface of the EUV collector mirror M1, as shown in FIG. 27B. The H₂ gas from the hydrogen gas supply source 252 may be blown out through the slit 263 a in the outer pipe 263 via the pipe 262. The outer pipe 263 may be positioned such that the center of the annular outer pipe 263 substantially coincides with the center of the EUV collector mirror M1. With this, the H₂ gas may flow along the reflective surface of the EUV collector mirror M1 from the periphery toward the center thereof. Here, the center of the EUV collector mirror M1 may be the rotational axis of the spheroidal surface.

According to the seventh embodiment, the H₂ gas may flow along the reflective surface of the EUV collector mirror radially from the center toward the periphery and also from the periphery toward the center. With this, debris generated in the plasma generation region P1 may be prevented from being deposited on the reflective surface of the EUV collector mirror M1. Further, even when the debris is deposited on the reflective surface, the deposited debris may be etched.

The H₂ gas supplied into the sub-chamber 211 may flow along the surface of each optical element. With this, the debris may be prevented from being deposited on the optical elements. Further, even when the debris is deposited on the optical elements, the deposited debris may be etched.

The above-described embodiments and the modifications thereof are merely examples for implementing this disclosure, and this disclosure is not limited thereto. Making various modifications according to the specification or the like is within the scope of this disclosure, and other various embodiments are possible within the scope of this disclosure. For example, the modifications illustrated for particular embodiments can be applied to other embodiments as well including the other embodiments described herein.

As a device for controlling the temperature of an optical element, an example in which a temperature-controlled heat carrier is made to flow in the substrate of the optical element or an example in which the heater and the chiller are used in combination has been shown. However, this disclosure is not limited thereto, and any system capable of heating and cooling may be applied. For example, a Peltier element may be used, and the temperature of the optical element may be controlled with high precision by controlling electric current supplied to the Peltier element.

The terms used in this specification and the appended claims should be interpreted as “non-limiting.” For example, the terms “include” and “be included” should be interpreted as “including the stated elements but not limited to the stated elements.” The term “have” should be interpreted as “having the stated elements but not limited to the stated elements.” Further, the modifier “one (a/an)” should be interpreted as at least one or “one or more.” 

1. An apparatus for generating extreme ultraviolet light comprising: a chamber provided with at least one inlet through which a laser beam is introduced into the chamber; a target supply unit provided on the chamber configured to supply a target material to a predetermined region inside the chamber; a discharge pump connected to the chamber; at least one optical element provided inside the chamber; an etching gas introduction unit provided on the chamber configured to allow an etching gas to pass through; and at least one temperature control mechanism configured to control a temperature of the at least one optical element.
 2. The apparatus according to claim 1, wherein the target material is tin.
 3. The apparatus according to claim 1, wherein the etching gas is H₂ gas.
 4. The apparatus according to claim 1, wherein the etching gas is H radical gas.
 5. The apparatus according to claim 1, wherein the etching gas introduction unit is provided with at least one opening, and the etching gas introduction unit is positioned so that the at least one opening is orientated toward a surface of the at least one optical element.
 6. The apparatus according to claim 1, wherein the at least one temperature control mechanism includes a first temperature control mechanism connected to the at least one optical element, and the first temperature control mechanism includes: a temperature control element provided on the at least one optical element; a power supply connected to the temperature control element configured to supply electric current to the temperature control element; a temperature sensor configured to detect a temperature of the at least one optical element; and a temperature controller configured to control the temperature of the optical element by controlling the electric current supplied to the temperature control element from the power supply based on the temperature detected by the temperature sensor.
 7. The apparatus according to claim 6, wherein the first temperature control mechanism further includes: a heat carrier; a temperature control unit configured to control the temperature of the heat carrier and allow the heat carrier to circulate; and a flow channel configured to guide the temperature-controlled heat carrier from the temperature control unit to the optical element.
 8. The apparatus according to claim 6, wherein the temperature control element is a Peltier element.
 9. The apparatus according to claim 6, wherein the first temperature control mechanism is configured to retain the temperature of the at least one optical element within a first predetermined temperature range.
 10. The apparatus according to claim 9, wherein the first predetermined temperature range is a temperature range within which a reaction rate at which the target material reacts with the etching gas and a gaseous reactant is generated is greater than a reaction rate at which the gaseous reactant is decomposed and the target material is deposited.
 11. The apparatus according to claim 1, further comprising at least one trap unit provided inside the chamber, the trap unit configured to trap the target material deposited from a gaseous reactant of the target material and the etching gas.
 12. The apparatus according to claim 11, wherein the at least one optical element includes a collector mirror configured to collect the extreme ultraviolet light emitted in the predetermined region inside the chamber, and the at least one trap unit includes a first trap unit provided between the predetermined region inside the chamber and a reflective surface of the collector mirror.
 13. The apparatus according to claim 12, wherein the first trap unit includes: a temperature sensor configured to detect a temperature of the first trap unit; a heater configured to heat the first trap unit; a power supply configured to supply electric current to the heater; and a temperature controller configured to control the electric current supplied to the heater from the power supply based on the temperature detected by the temperature sensor, and the first trap unit has a passing hole formed therein through which the extreme ultraviolet light passes.
 14. The apparatus according to claim 13, wherein the temperature controller is further configured to control the electric current supplied to the heater so that the temperature of the first trap unit is retained within a temperature range which is lower than the melting point of the target material and within which a reaction rate at which the target material reacts with the etching gas and the gaseous reactant is generated is lower than a reaction rate at which the gaseous reactant is decomposed and the target material is deposited.
 15. The apparatus according to claim 13, wherein: the temperature controller is further configured to control the electric current supplied to the heater so that the temperature of the first trap unit is retained within a temperature range which is equal to or higher than the melting point of the target material and lower than the boiling point of the target material and within which a reaction rate at which the target material reacts with the etching gas and the gaseous reactant is generated is lower than a reaction rate at which the gaseous reaction product is decomposed and the target material is deposited, and the first trap unit further includes a collection unit configured to collect the target material that is molten on the first trap unit.
 16. The apparatus according to claim 11, wherein the at least one trap unit includes a second trap unit provided inside the chamber in the vicinity of a connection part between the chamber and the external apparatus.
 17. The apparatus according to claim 16, wherein the second trap unit includes: a temperature sensor configured to detect a temperature of the second trap unit; a heater configured to heat the second trap unit; a power supply configured to supply electric current to the heater; and a temperature controller configured to control the electric current supplied to the heater from the power supply based on the temperature detected by the temperature sensor, and the second trap unit has a passing hole formed therein configured to allow the extreme ultraviolet light to pass through.
 18. The apparatus according to claim 17, wherein the temperature controller is further configured to control the electric current supplied to the heater so that the temperature of the second trap unit is retained within a temperature range which is lower than the melting point of the target material and within which a reaction rate at which the target material reacts with the etching gas and the gaseous reactant is generated is lower than a reaction rate at which the gaseous reactant is decomposed and the target material is deposited.
 19. The apparatus according to claim 17, wherein: the temperature controller is further configured to control the electric current supplied to the heater so that the temperature of the second trap unit is retained within a temperature range which is equal to or higher than the melting point of the target material and lower than the boiling point of the target material and within which a reaction rate at which the target material reacts with the etching gas and the gaseous reactant is generated is lower than a reaction rate at which the gaseous reactant is decomposed and the target material is deposited, and the second trap unit further includes a collection unit configured to collect the target material that is molten on the second trap unit.
 20. The apparatus according to claim 11, wherein the at least one trap unit includes a third trap unit provided inside the chamber at a connection part between the chamber and the discharge pump.
 21. The apparatus according to claim 20, wherein the third trap unit includes: a temperature sensor configured to detect a temperature of the third trap unit; a heater configured to heat the third trap unit; a power supply configured to supply electric current to the heater; and a temperature controller configured to control the electric current supplied to the heater from the power supply based on the temperature detected by the temperature sensor, and the third trap unit is formed to have air permeability.
 22. The apparatus according to claim 21, wherein the temperature controller is further configured to control the electric current supplied to the heater so that the temperature of the third trap unit is retained within a temperature range which is lower than the melting point of the target material and within which a reaction rate at which the target material reacts with the etching gas and the gaseous reactant is generated is lower than a reaction rate at which the gaseous reactant is decomposed and the target material is deposited.
 23. The apparatus according to claim 21, wherein: the temperature controller is further configured to control the electric current supplied to the heater so that the temperature of the third trap unit is retained within a temperature range which is equal to or higher than the melting point of the target material and lower than the boiling point of the target material and within which a reaction rate at which the target material reacts with the etching gas and the gaseous reactant is generated is lower than a reaction rate at which the gaseous reactant is decomposed and the target material is deposited, and the third trap unit further includes a collection unit configured to collect the target material that is molten on the third trap unit.
 24. The apparatus according to claim 11, wherein the at least one trap unit includes a fourth trap unit provided inside the chamber.
 25. The apparatus according to claim 24, wherein the fourth trap unit includes: a temperature sensor configured to detect a temperature of the fourth trap unit; a heater configured to heat the fourth trap unit; a power supply configured to supply electric current to the heater; and a temperature controller configured to control the electric current supplied to the heater from the power supply based on the temperature detected by the temperature sensor.
 26. The apparatus according to claim 25, wherein the temperature controller is further configured to control the electric current supplied to the heater so that the temperature of the fourth trap unit is retained within a temperature range which is lower than the melting point of the target material and within which a reaction rate at which the target material reacts with the etching gas and the gaseous reactant is generated is lower than a reaction rate at which the gaseous reactant is decomposed and the target material is deposited.
 27. The apparatus according to claim 26, wherein: the temperature controller is further configured to control the electric current supplied to the heater so that the temperature of the fourth trap unit is retained within a temperature range which is equal to or higher than the melting point of the target material and lower than the boiling point of the target material and within which a reaction rate at which the target material reacts with the etching gas and the gaseous reactant is generated is lower than a reaction rate at which the gaseous reactant is decomposed and the target material is deposited, and the fourth trap unit further includes a collection unit configured to collect the target material that is molten on the fourth trap unit.
 28. An apparatus for generating extreme ultraviolet light comprising: a chamber provided with at least one inlet through which a laser beam is introduced into the chamber; a target supply unit provided on the chamber configured to supply a target material to a predetermined region inside the chamber; a discharge pump connected to the chamber; a collector mirror configured to collect the extreme ultraviolet light emitted from plasma of the target material; and a gas supply unit provided with a gas outlet and positioned so that the gas outlet is oriented toward a reflective surface of the collector mirror.
 29. The apparatus according to claim 28, wherein: the gas supply unit includes a pipe arranged along at least a part of the periphery of the reflective surface of the collector mirror, and the gas outlet is formed in the pipe.
 30. The apparatus according to claim 29, wherein the gas outlet is either one of an opening and a slit.
 31. The apparatus according to claim 28, wherein: the gas supply unit includes a curved pipe and is positioned so that the curved pipe follows along the reflective surface of the collector mirror and is arranged to pass through the center of the reflective surface, and the curved pipe includes a gas outlet formed by an opening or a slit.
 32. The apparatus according to claim 28, wherein: the gas supply unit includes a ring-shaped pipe and is positioned so that the ring-shaped pipe surrounds the center of the reflective surface of the collector mirror, and the ring-shaped pipe includes a gas outlet and is positioned so that the gas outlet is orientated toward the periphery of the reflective surface.
 33. The apparatus according to claim 32, wherein the gas outlet is either one of an opening and a slit.
 34. The apparatus according to claim 28, wherein: the gas supply unit includes one or more curved pipes and is positioned so that the curved pipes extend from the center of the reflective surface of the collector mirror toward the periphery of the reflective surface and are curved along the reflective surface, and each of the curved pipes includes a gas outlet formed by an opening or a slit.
 35. The apparatus according to claim 28, wherein: the gas supply unit includes a pipe and is positioned so that the pipe is arranged at the center of the reflective surface of the collector mirror, and the pipe includes a ring-slit-shaped outlet oriented toward the reflective surface.
 36. The apparatus according to claim 28, wherein: the gas supply unit includes a fist pipe and a second pipe and is positioned so that the first pipe is arranged at the center of the reflective surface of the collector mirror and the second pipe is arranged along at least a part of the periphery of the reflective surface, the first pipe includes a ring-slit-shaped outlet oriented toward the reflective surface, and the second pipe includes an outlet oriented toward the reflective surface.
 37. The apparatus according to claim 36, wherein the outlet of the second pipe is either one of an opening and a slit.
 38. The apparatus according to claim 28, wherein the target material is tin.
 39. The apparatus according to claim 38, wherein the gas contains H₂.
 40. The apparatus according to claim 38, wherein the gas contains H radicals. 